12th of November 2018 (Besançon) – PhD defense of Guillaume Wong

Guillaume WONG will defend his thesis on 12th of November 2018 at 2:00 pm on the subject “Design of self-encapsulated surface acoustic wave sensors in intermediate frequencies into a prestressed environment”, realized in SYRTE under the direction of Bernard DULMET and Thomas BARON.

The defense will take place in the amphitheater J-J Gagnepain at TEMIS Sciences (Besançon).

Jury :
– M. CRUNTEANU STANESCU Aurelian – Chargé de Recherche CNRS, XLIM – Rapporteur
– M. AUBERT Thierry – Maître de Conférences HDR, Centrale-Supélec – Rapporteur
– M. THERON Didier – Directeur de Recherche CNRS, IEMN – Examinateur
– M. CHOLLET Franck – Professeur des Universités, Université de Franche-Comté – Examinateur
– M. DULMET Bernard – Professeur des Universités, E.N.S.M.M – Directeur de thèse
– M. BARON Thomas – Ingénieur de Recherche HDR, E.N.S.M.M – Codirecteur de thèse

The defense will followed by a buffet at Time and Frequency Department in ENSMM.

Abstract: This thesis is part of the research and development of surface elastic wave components for the harsh environments exceeding 600°C. The objective is the realization of surface elastic waves self-encapsulated components which can reach a temperature of 900 ° C. In this work, we introduce a modulization method allowing a finite element finite resolution of an inhomogeneous bias. This method allows to directly calculate the bias problem and to extract the parameters calculated with the perturbation method as well as other parameters. This method contributes to the improvement of the realism of numerical simulations of structures subjected to wide variations of environmental parameters. We describe in this manuscript the approach of the study, the design, the realization and the tests of unencapsulated surface wave resonators for air annealing cycles up to 900 ° C as well as a bench of measurements allowing to perform the measurements in situ. We also discuss the design and implementation of the encapsulation of these resonators by an innovative technology by Wafer-Level Packaging for high temperatures.