Design and fabrication of passive radio frequency components
In that context, the company develops new competences in the field of MEMS, particularly for the fabrication of composite materials combining piezoelectric thinned wafers bounded to any single crystal wafer. This activity is developed in close collaboration with FEMTO-ST. The company benefits from a solid experience in the design and fabrication of such devices for prototyping and small series. The theoretical design and analysis tools it uses for developing its activity are unique and enable one to address almost any wave guide configuration. frec|n|sys also currently integrates facilities and know-how for on-trench ferroelectric domain engineering using LiNbO3 and LiTaO3 substrates for both RF and optics markets and acts as a foundry for non-standard materials and related technologies.
More specifically, the company dedicates a strong R&D effort for the development of battery-less and wireless sensors capable to operate under very harsh environment, particularly high temperature conditions with a target at 1000°C. In that pursuit, the company exploits results based on SAW sensors designed to operate above 500°C (700°C demonstrated) for which a new solution for sensor/antenna assembly has been developed and protected (result of European project SAWHOT).
Contact FIRST-TF : Sylvain BALLANDRAS
Mail : sylvain.ballandras(at)frecnsys.fr